Plotted by close date where disclosed, otherwise announcement. Select any marker to jump to the deal entry.
Three patterns run through TAIWAN SEMICONDUCTOR MANUFACTURING's acquisitions — what it looks for, how it pays, and how it folds in what it buys.
7 acquisitions — each with the deal value, financing structure, target revenue, and executive commentary where disclosed.
Worldwide Semiconductor Manufacturing Corporation was the third-largest dedicated foundry in Taiwan, established in May 1996. In June 2000, with demand for foundry services running hot, TSMC acquired WSMC to rapidly add manufacturing capacity. The transaction was structured as a merger and accounted for as a pooling-of-interest, so TSMC's consolidated financial statements were restated to include WSMC's results for all periods presented.
To rapidly increase our capacity in response to strong demand for our services in early 2000, in June 2000, we acquired Worldwide Semiconductor, the third-largest dedicated foundry in Taiwan established in May 1996. The merger was accounted for as a pooling-of-interest.TSMC FY2003 Form 20-F — Item 4 Business
In August 1999 TSMC acquired 32% of Acer Semiconductor Manufacturing Inc., a specialized DRAM manufacturer with one 200mm fab in the Hsinchu Science Park, and the company was renamed TSMC-Acer Semiconductor Manufacturing Corporation. On June 30, 2000, TSMC acquired by merger the remaining interest it did not already own; the merger was accounted for as a purchase, and TSMC-Acer's results were consolidated from the merger date.
To rapidly increase our capacity in response to strong demand for our services in 1999, in August 1999, we acquired 32% of the outstanding equity securities of Acer Semiconductor Manufacturing Inc. ... On June 30, 2000, we acquired by merger the remainder of TSMC-Acer that we did not already own. The merger was accounted for as a purchase.TSMC FY2003 Form 20-F — Item 4 Business
WaferTech began in 1996 as a joint venture between TSMC and several U.S.-based investors to build and run an approximately US$1.2 billion foundry in Camas, Washington. TSMC raised its stake to 68% in December 1998, then bought out the remaining joint-venture partners to reach roughly 99% by the end of the first quarter of 2001 and effectively 100% thereafter. The entity was renamed TSMC Washington in December 2023.
In 1996, we entered into a joint venture called WaferTech with several US-based investors to construct and operate a US$1.2 billion foundry in the United States. ... In December 1998, we purchased a part of the interest from the joint venture partners and thereby increased our percentage interest in WaferTech to 68%. By the end of the first quarter of 2001, we had increased our percentage ownership of WaferTech to approximately 99% by purchasing all of the remaining interest of all the joint venture partners.TSMC FY2003 Form 20-F — Item 4 Business
In January 2003 TSMC acquired a 52.0% equity interest in Global Unichip Corporation, an SoC design-service company that provides large-scale SoC implementation services. GUC listed on the Taiwan Stock Exchange in November 2006; following the listing and subsequent dilution, TSMC held approximately 34.8% of GUC as of February 28, 2026.
In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services. GUC listed its shares on the Taiwan Stock Exchange in November 2006.TSMC FY2025 Form 20-F — Item 4 Business
In January 2007 TSMC acquired a 51.2% equity interest in Xintec, Inc., a supplier of wafer-level packaging services, to support its CMOS image sensor manufacturing business. Xintec listed on the Taipei Exchange in March 2015; after IPO dilution TSMC held approximately 41.0% of Xintec as of February 28, 2026.
In January 2007, we acquired a 51.2% equity interest in Xintec, a supplier of wafer level packaging service, to support our CMOS image sensor manufacturing business. In March 2015, Xintec listed its shares on the Taipei Exchange.TSMC FY2025 Form 20-F — Item 4 Business
VisEra Technologies was formed in October 2003 as a joint venture between TSMC and OmniVision Technologies Inc. (OVT) to provide back-end services for the CMOS image sensor manufacturing business. In November 2015 TSMC acquired all of OVT's equity interest in VisEra, taking control of the venture. After a partial share disposal for VisEra's 2021 IPO, TSMC owned approximately 67.2% as of February 28, 2026.
In October 2003, we and OmniVision Technologies Inc. (OVT) entered into an agreement to form VisEra Technologies, a joint venture in Taiwan, for the purpose of providing back-end service for CMOS image sensor manufacturing business. In November 2015, we acquired all of OVT's equity interest in VisEra Technologies.TSMC FY2025 Form 20-F — Item 4 Business
In July 2007 TSMC acquired a controlling interest in Mutual-Pak Technology Co., Ltd., a New Taipei, Taiwan-based company engaged in the manufacture and sale of electronic parts and in the research, development and testing of RFID (radio-frequency identification) technology. The stake was taken through TSMC's venture-capital vehicle VTAF III (VentureTech Alliance Fund III), which increased its holding from roughly 13% in March 2007 to about 51% by July 2007. From that point TSMC consolidated Mutual-Pak's results as a majority-owned subsidiary. TSMC later ceased to hold majority voting control of the company in December 2017.