TSMC is hosting our earnings conference call via live audio webcast through the company's website at www.tsmc.com, where you can also download the earnings release materials. Wendell Huang, will summarize our operations in the first quarter 2026, followed by our guidance for the second quarter 2026. Wendell Huang, for the summary of operations and the current quarter guidance. After that, I will provide the guidance for the second quarter 2026.

First quarter revenue increased 8.4% sequentially in TWD, supported by strong demand for our leading-edge process technologies. dollar terms, revenue increased 6.4% sequentially to $35.9 billion, slightly ahead of our first quarter guidance. Gross margin increased 3.9 percentage points sequentially to 66.2%, primarily due to cost improvement efforts, a high capacity utilization rate, and a more favorable foreign exchange rate. Operating margin improved 4.1 percentage points sequentially to 58.1% due to operating leverage.

Overall, our first quarter EPS was TWD 22.08 and ROE was 40.5%. 3 nm process technology contributed 25% of wafer revenue in the first quarter, while 5 nm and 7 nm accounted for 36% and 13% respectively. Advanced technologies, defined as 7 nm and below, accounted for 74% of wafer revenue. HPC increased 20% quarter-over-quarter to account for 61% of our first quarter revenue.

What went well
  • First quarter revenue rose to $35.9 billion, up 6.4% sequentially in USD (8.4% in TWD) and slightly ahead of guidance, driven by strong demand for leading-edge process technologies.
  • Gross margin jumped 390 basis points sequentially to 66.2%, exceeding the high end of prior guidance by 120 basis points on cost-improvement efforts, higher capacity utilization and a more favorable foreign exchange rate.
  • Operating margin improved 410 basis points sequentially to 58.1% on operating leverage; EPS was TWD 22.08 and ROE reached 40.5%.
  • AI-related demand described as extremely robust, with the shift from generative to agentic AI stepping up token consumption; HPC platform grew 20% sequentially to 61% of revenue.
  • Raised full-year 2026 revenue growth guidance to above 30% in USD, and reiterated the AI accelerator CAGR toward the higher-50s% for 2024-2029.
  • N2 in high-volume manufacturing since Q4 2025 with good yield, ramping multi-phase at Hsinchu and Kaohsiung; stepping up N3 capacity globally with new fabs in Tainan, Arizona and Japan.
What went wrong
  • Smartphone revenue fell 11% sequentially to 26% of revenue, and automotive fell 7%, as memory price hikes softened price-sensitive PC and smartphone markets.
  • The initial 2nm ramp will start diluting gross margin in the second half of 2026, with 2%-3% dilution expected for full-year 2026; overseas fab dilution is forecast at 2%-3% early stage widening to 3%-4% later.
  • Second quarter tax rate will be around 20% due to accrual of tax on undistributed retained earnings (full-year still 17%-18%).
  • The Middle East situation may raise prices for certain chemicals and gases with a possible profitability impact, though too early to quantify.
  • Capacity remained very tight across nodes and packaging; management expects the demand-supply gap to persist, with new fabs taking 2-3 years to build (relief not before 2027-2028).

Guidance Changes

MetricPeriodCurrent guidance
RevenueQ2 2026$39.0B-$40.2B (+10% QoQ / +32% YoY at midpoint)
Gross marginQ2 202665.5%-67.5% (+30 bps at midpoint)
Operating marginQ2 202656.5%-58.5%
Tax rateQ2 2026~20% (elevated by accrual on undistributed retained earnings)
Full-year revenue growthFY 2026above 30% (USD) (raised)
Capital budgetFY 2026toward the high end of $52B-$56B (raised toward high end)

Performance Breakdown

MetricYoYNote
Gross margin Reached 66.2%, up 390 bps sequentially on cost improvement, high utilization and favorable FX; YoY not disclosed on the call.
HPC platform revenue Up 20% sequentially to 61% of revenue on robust HPC/AI demand; YoY not disclosed.
Smartphone revenue Down 11% sequentially to 26% of revenue as memory price hikes weighed on price-sensitive segments.
Q2 2026 revenue (guided) +32% Guided +32% YoY at the midpoint on continued strong leading-edge demand.

Earnings Call Themes & Trends

TopicPrevious mentionCurrent periodTrend
AI / HPC demandStrong; AI accelerator CAGR raised to mid-to-high 50s% in Q4Extremely robust; agentic AI shift stepping up token consumption; CAGR toward higher 50s%Increasing
CapEx$52B-$56B budget setToward high end of $52B-$56B; next three years to be significantly higher than prior $101BIncreasing
N2 rampEntered high-volume manufacturing in Q4 2025Ramping multi-phase at Hsinchu and Kaohsiung with good yield on smartphone and HPC AI demandIncreasing
N3 capacity and marginGlobal N3 capacity step-up (new fabs in Tainan, Arizona, Japan); N3 gross margin to cross corporate average in H2 2026Expanding
Overseas expansion / dilutionPulling forward Arizona scheduleSecond Arizona land purchased, more fabs planned; dilution 2%-3% early to 3%-4% laterExpanding
Non-AI / consumer softnessMild recovery, memory price risk flaggedMemory price hikes softening price-sensitive PC and smartphone; high-end smartphone still strongWeakening

Q&A Summary

What applications drive the strong multi-year 3nm demand and its margin outlook?
Primarily HPC AI applications (including HBM-based ASICs), plus smartphone, automotive and IoT. N3 gross margin expected to cross the corporate average in H2 2026, and margins are generally very high after full depreciation.
What gives incremental confidence to guide CapEx to the high end of $52B-$56B?
Very robust demand, especially HPC and AI; TSMC is pulling in equipment as fast as possible but supply remains very tight and demand keeps increasing.
How long will the supply constraint last and can capacity win customers back?
It takes 2-3 years to build a fab and 1-2 more to ramp; tightness expected to continue, with three new fabs announced. There are no shortcuts in foundry, and TSMC is confident in its technology position.
Has the long-term margin and return structure changed given supernormal AI-chain returns?
Targets unchanged: gross margin 56% and higher through the cycle, ROE in the high-20s%. Long-term planning is continuous and will be updated if it changes.
Will data center CPUs be included in the AI accelerator revenue definition?
Not yet, because TSMC cannot identify which CPUs go to AI data centers versus PCs/desktops; it may consider including them later.
Why acquire a second parcel of land in Arizona and how are the economics?
It is needed to build more fabs to meet multi-year demand from leading-edge US customers; TSMC has much more confidence than last year and expects to improve the cost structure.

More on Taiwan Semiconductor Manufacturing Co Ltd

Reported 2026-04-16 · figures from the Taiwan Semiconductor Manufacturing Co Ltd Q1 2026 earnings call.

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