Dr. David H. Wang founded ACM Research in 1998 and serves as its Chairman, Chief Executive Officer and President, and has been a director since 1998. He is the inventor of ACM's stress-free copper polishing technology and holds more than 100 patents in semiconductor equipment and process technology. Under his leadership ACM has built a broad portfolio of differentiated wet-processing tools spanning single-wafer cleaning, electrochemical plating, furnace, track, PECVD and advanced-packaging equipment, with operations conducted primarily through its ACM Research (Shanghai), Inc. subsidiary. He holds a Ph.D. and a Master of Engineering in precision engineering from Osaka University and a Bachelor of Science in precision instruments from Tsinghua University. David Wang and Jian Wang are brothers.